In a major advancement for chip technology, the introduction of Universal Chiplet Interconnect 2.0 (UCIe 2.0) is set to revolutionize the speed and efficiency of next-generation chips.

This new specification promises up to 75 times the bandwidth of its predecessor, enhancing 3D chip designs that incorporate tightly stacked chiplets.

The UCIe 2.0 specification is designed for use in 3D chip structures, offering substantial improvements in both speed and power efficiency compared to the 2D designs of previous specifications. As noted by Debendra Das Sharma, chair of the UCIe Consortium, the new standard focuses on delivering substantial bandwidth with minimal power consumption, paving the way for more efficient computing.

The adoption of 3D chip designs, featuring vertically stacked chiplets, marks a significant shift from traditional 2D configurations. This transition enables more robust communication channels between chiplets, which were previously limited by linear connections. The move to 3D packaging not only boosts bandwidth but also enhances power efficiency.

The UCIe 2.0 standard allows for an increase in communication speed to up to 4 GT/s per channel, similar to UCIe 1.1 but with many more connecting wires. This advancement results in a dramatic reduction in power consumption, with UCIe 2.0 achieving up to 0.01 picojoules per bit at a 1-micron bump pitch, compared to the higher power requirements of previous technologies.

This updated specification also facilitates the integration of new optical interconnects and proprietary protocols, expanding its versatility and adoption across various chip manufacturers, including TSMC, Samsung, and Intel. The specification aims to support emerging technologies and enhance the capabilities of chipmakers to develop more sophisticated applications.

While there is no immediate timeline for when chips utilizing UCIe 2.0 will hit the market, the new standard is anticipated to significantly impact the industry, with ongoing developments and future specifications on the horizon.